Photonics Packaging Engineer

IC Resources · Pisa, Toscana, Italia ·


Descrizione dell'offerta

My client is looking for a Packaging Engineer , experienced in photonic and optoelectronic devices to join their R&D team , onsite in Italy!


You’ll lead the design, assembly, and optimisation of cutting-edge photonic packaging solutions , working within a collaborative, cross-functional team that supports your growth and development.

Your Responsibilities:

  • Design and develop photonic and optoelectronic packaging solutions
  • Create mechanical and optical component layouts
  • Support micro-optical and fiber optic assembly process
  • Engage in semiconductor assembly process

Must Haves :

  • Masters degree in Physics, Electronics Engineering or similar
  • Semiconductor, photonics packaging, micro-optical assembly process knowledge
  • CAD Design tools eg. SolidWorks

Good to Have:

  • Understanding of PICs
  • Cleanroom and advanced packaging technologies experience

This is a super exciting opportunity to work for innovative generative AI technologies alongside industry-leading scientists. If you're interested, contact Ella Flynn at IC Resources

Candidatura e Ritorno (in fondo)